PCB Fab ONLY! - Printed Circuit Board Fabrication, PWB Manufacturing

50+
0.002"
0.0023"
0.0025"
0.0025"
0.004"
0.002"
27 to 1
1.2 to 1
+/- 0.001"
+/- 0.002"
+/- 0.0012"
0.500"
.0015"
3%
5%
0.01"
0.006"
0.006"
24.8" x 46.1"
Yes
Yes
Yes

PCB MANUFACTURING CAPABILITIES

Standard

Future

Printed Circuit Boards (Rigid)

Layer Count
Min. Inner Layer Trace
Min. Inner Layer Space
Min. Outer Layer Trace
Min. Outer Layer Space
Min. Drill Hole Size - Mechanical
Min. Drill Hole Size - Laser
Max. Mechanical Drill Aspect Ratio
Max. Laser Drill Aspect Ratio
Plated Hole Tolerance
Hole Location Tolerance
Layer to Layer Registration Tolerance
Max. Finished Thickness
Min. Dielectric Thickness
Min. Impedance - Single End
Min. Impedance - Differential
Min. Plane Relief Over Plated Hole
Min. Inner Pad Size Over Plated Hole
Min. Outer Pad Size Over Plated Hole
Max. Board Size
Buried Passives
Via in Hole
Controlled Depth Drilling

2 to 30
0.004"
0.004"
0.005"
0.005"
0.008"
0.004"
10 to 1
.8 to 1
+/- 0.003"
+/- 0.003"
+/- 0.004"
0.250"
0.003"
10%
10%
0.018"
0.012"
0.012"
22" x 28"
No
Yes
Yes

48 Max.
0.002"
0.003"
0.003"
0.005"
0.003"
25 to 1
1 to 1
+/- 0.002"
+/- 0.002"
+/- 0.0015"
0.330"
0.002"
5%
5%
0.012"
0.006"
0.01"
24.8" x 45.7"
Yes
Yes
Yes
Yes

Layer Count
Min. Inner Layer Trace
Min. Inner Layer Space
Min. Outer Layer Trace
Min. Outer Layer Space
Min. Dielectric Thickness of Flex
Min. Base Copper Thickness of Flex
Min. Drill Hole Size - Mechanical
Min. Drill Hole Size - Laser (Flex)
Photo-imageable Coverlay
Solver Shielding